A chipset cooling device of a video graphics adapter (VGA) card that includes two heatsinks mounted on respective opposite surfaces of a VGA card to collectively cool a chipset of the VGA card is provided. In the chipset cooling device of a VGA card, two heatsinks are mounted on opposite surfaces of a printed circuit board (PCB) of the VGA card, respectively, and connected together by a heatpipe. Due to the use of two heatsinks to collectively cool a chipset, cooling efficiency is higher as opposed to using a single heatsink. In particular, a binding portion between a heatsink contacting the chipset of the VGA card and the heatpipe is always positioned at a lower level than a binding portion between the other, opposite heatsink and the heatpipe, thereby further enhancing the heat conduction performance of the heatpipe.