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A system for delivering power to an integrated circuit includes a decoupling
capacitance
located in a connector that is formed as a socket, or frame for the IC. The power
delivery system takes the form of a power reservoir that is integrated into a connector,
thereby eliminating the need for complex and expensive power traces to be formed
in or discrete capacitors mounted on a circuit board to which the IC is connected.
The system includes a connector that takes the form of a cover member that fits
over the IC and which contains a recess that accommodates a portion of the IC therein.
The cover member includes at least a pair of spaced-apart capacitor plates that
are disposed therewithin. Electricity is supplied to the plates so that they will
become charged as a capacitor and the plates are formed with a plurality of terminals
that extend into contact with the IC so that the plates may selectively discharge
to the IC and thereby provide it with operating and surge currents.
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< Optical transceiver, connector, substrate unit, optical transmitter, optical receiver, and semiconductor device
< Developer charging unit, developing device, image-forming apparatus, and computer system
> High-frequency package
> Method to form very a fine pitch solder bump using methods of electroplating
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~ 00204
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