A treated backing comprises a fabric and a composition that comprises epoxy resin preparable by reaction of epichlorohydrin with at least one of bisphenol A or bisphenol F, polyfunctional (meth)acrylate, dicyandiamide, and photoinitiator.

 
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< Conductive paste for via conductor, ceramic wiring board using the same, and method of manufacturing the same

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> Optical recording medium, and method and device using the same

> One-part, room temperature moisture curable resin composition
~ 00204