To provide a light emitting device having a high reliability wherein no resin burrs occur, The semiconductor device comprises a semiconductor element, a package having a recess for housing the semiconductor element and a mold member for sealing the semiconductor element in the recess and the package comprises lead electrodes and a package support part supporting the lead electrodes so that main surfaces of the tip portions of the lead electrodes are exposed from the bottom surface of the recess.


< Forming an optical element on the surface of a light emitting device for improved light extraction

< Card-type LED illumination source

> Communication device

> Semiconductor light-emitting device

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