To provide a light emitting device having a high reliability wherein no resin
burrs occur, The semiconductor device comprises a semiconductor element, a package
having a recess for housing the semiconductor element and a mold member for sealing
the semiconductor element in the recess and the package comprises lead electrodes
and a package support part supporting the lead electrodes so that main surfaces
of the tip portions of the lead electrodes are exposed from the bottom surface
of the recess.