A hermetically sealed connector comprises an outer metallic shell having an aperture that receives a multipin-retaining, multi-metallic insert. The insert is a laminate of dissimilar metals, including a first metal extending to a first side of the insert and having a first coefficient of thermal expansion (CTE), and a second metal extending to a second side of the insert and having a second CTE different that the first CTE. A plurality of bores extend between first and second sides of the insert and contain connector pins that are hermetically sealed with the first metal of the insert by a dielectric material formed between the pins and sidewalls of the bores. A bond joint is formed between the second metal of the insert and the side of the outer metallic shell adjacent to the second side of the metallic insert.