The invention provides a hot melt adhesive composition including a tubular reactor copolymer of ethylene and 5 to 20 mol % of comonomer units derived from an alkyl acrylate or alkyl methacrylate, wherein the copolymer has a melt index of at least 300 g/10 min. The alkyl group of the alkyl acrylate or alkyl methacrylate can be a linear or branched C₁ to C₁₂ group, particularly n-butyl. If desired, the hot melt adhesive can further include tackifiers, waxes, antioxidants and other desired additives. The hot melt adhesive composition shows improved heat resistance and favorable properties, such as has a shear adhesion fail temperature of at least 80 C., without the need to use high melting waxes. The invention further provides articles such as cartons, cases, trays, bookbindings or disposables including the hot melt adhesive compositions.