A system for laser peening a workpiece. The system comprises a world coordinate frame, a robot operatively connected to the world coordinate frame for moving the workpiece relative, a calibration tool operatively connected to the robot for determining a multiplicity of data points of the workpiece, a computer for storing and using the multiplicity of data points of the workpiece, and a laser system for laser peening the workpiece using the multiplicity of data points.

 
Web www.patentalert.com

< Multi-joint robot and control device thereof

< Industrial robot

> Blade of wafer transfer robot, semiconductor manufacturing equipment having a transfer robot comprising the same, and method of aligning a wafer with a process chamber

> Robot system and controller

~ 00210