A GaN light emitting diode for flip-chip bonding, with sufficient bonding area, optimized electrode arrangement, and improved brightness and reliability, includes n-electrodes and a p-electrode which are formed as stripes. The n-electrodes are positioned at equal distances from the p-electrode and arranged in parallel, thus the electric current is not concentrated into a predetermined portion, but uniformly flows through the light emitting diode without reducing a light emitting area.