Embodiments of the present invention recite a heat dissipating system. In one embodiment, a heatsink comprising a plurality of cooling elements substantially encases a fan assembly disposed therein. When in operation, at least a portion of intake air for the fan assembly is caused to traverse the plurality of cooling elements prior to being exhausted from the fan assembly.

 
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< Heat dissipation assembly with resilient fastener

< Protection structure for thermal conducting medium of heat dissipation device

> Multi-chip module with stacked redundant power

> Hybrid loop cooling of high powered devices

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