A reed relay or reed sensor device that is substantially lead-less and has minimal inductance can be manufactured as an individual unit or as a plurality of units. The reed relay or reed sensor device comprises a substrate that has a plurality contacts on the exterior of the device connected to contacts on the interior of the device capable of maintaining a signal pathway to the internal components of the device. The internal components further comprise a reed switch, an electrical shield, a coil bobbin, and a coil of electrical wire which when energized is capable of effectuating switching in the reed relay.