An endovascular device assembly includes a delivery member to deliver the assembly endoluminally to an aneurysm, a detachable endovascular device including a thermo-resistive element to deliver heat to the device by passing a first electrical current through the thermo-resistive element, whereupon the device expands to a predetermined shape. The endovascular device is connected to the delivery member by a detachable joint, such as an electrolytic sacrificial joint that separates by passing a second electrical current therethrough, to deploy the device within the aneurysm to promote embolization.