A lead conductor member for a thin-film magnetic head, includes a plurality of
head connection pads to be connected to a plurality of terminal electrodes of a
thin-film magnetic head element, a plurality of external connection pads used for
external connections, a plurality of trace conductors, one end of each of the plurality
of trace conductors being connected to the plurality of head connection pads and
the other ends of the plurality of trace conductors being connected to the plurality
of external connection pads, respectively, and at least one pair of test connection
pads capable of being temporally and electrically short-circuited with at least
one pair of trace conductors of the plurality of trace conductors, respectively.