A semiconductor light-emitting element 1 is mounted on a substrate 2 with an anisotropically conductive adhesive 3, which has electrically conductive particles 32 dispersion-mixed with a thermosetting resin 31, laid between a pair of electrodes 11 and 11 formed on the same surface of the semiconductor light-emitting element and wiring electrodes 21 and 21 formed on the substrate 2. Depressions 22 and 22 are formed in the portion of the surface of the wiring electrodes 21 and 21 facing the semiconductor light-emitting element 1 so that the electrically conductive particles 32 are stably present between the pair of electrodes 11 and 11 and the wiring electrodes 21 and 21.