A semiconductor laser device has a semiconductor laser element, light receiving
element, lead frame, and package. The semiconductor laser element is an element
for emitting a laser beam. The light receiving element is a chip-shaped element
which receives a monitoring laser beam emitted from the semiconductor laser element.
The semiconductor laser element and the light receiving element are mounted on
the lead frame. The package surrounds the semiconductor laser element and the light
receiving element, and has a light reflecting surface on at least a portion of
its inner surface.