Defect analysis of an integrated circuit die having a back side opposite circuitry
at a circuit side and a liquid crystal liquid is enhanced using near infrared (nIR)
laser light. According to an example embodiment of the present invention, nIR laser
light is directed to an integrated circuit die having a liquid crystal layer formed
over the die. When the die includes a defect that generates heat, the heat generated
in the die as a result of the nIR laser light adds to the heat in the die generated
as a result of the defect and causes a portion of the liquid crystal layer to change
phase near the defect. The phase change is detected and used to identify a portion
of the die having a defect.