The invention relates to a high frequency module with a hollow conductor structure,
consisting of a housing bottom and a housing lid, preferably consisting of ceramic.
The housing bottom and the housing lid are preferably coordinated with each other
in terms of their expansion characteristics. The adjusting device is mounted on
the housing lid for positioning on the housing bottom, and consists of a raised
photosensitive resist part which tapers conically starting from the housing lid.
The adjusting device engages with the hollow conductor on assembly. The layer thickness
of the adjusting device is approximately 100 to 200 m. The housing bottom
and the housing lid are permanently interconnected by soldering, preferably using
solders which are introduced galvanically in solder deposits. To this end, the
solder is either applied locally to the housing lid surface or introduced in vias
which are structured in the lid.