The invention is directed toward techniques for creating molded substrates for use in various different data storage media. The molded substrates have improved thickness profiles that can improve media quality, and in some cases facilitate higher data storage densities. In many cases, the improved thickness profile is a thickness profile that has improved flatness. Mechanical flatness or optical flatness can be achieved. In particular, optical flatness is desirable for substrates used in holographic data storage media having a sandwiched construction.