A polarizing film comprising a polarizer (A) and a protection film (B) prepared on at least one face of the polarizer (A), wherein the protection film (B) is adhered to the polarizer (A) without using adhesives, is induced problems by use of adhesives.

 
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< Polarizing plate having polarizer sides covered with low moisture permeable layers with permeability different than protective films covering the polarizer surfaces

< Circuit substrate, circuit-formed suspension substrate, and production method thereof

> Method and apparatus for joining adhesive tape to back face of semiconductor wafer

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