An apparatus and method for perforating, cutting, or engraving a workpiece using a focused laser system to produce a focused laser. The apparatus includes a workpiece former having a complex shape to which the workpiece substantially conforms. The apparatus also includes a positioner that makes an adjustment to keep the focused laser substantially focused on the workpiece as the positional relationship between the workpiece former and the focused laser system changes to an operating position that changes the distance between the workpiece and the focused laser system due to the complex shape of the workpiece former.