A method for manufacturing the dielectric ceramic layer and the internal polar layer of the multiple layer ceramic capacitor by the vacuum sputtering process in which the dielectric ceramic layer and the internal polar layer of the MLCC has a finest thinness of 15 m for the dielectric ceramic layer and 0.1 0.5 m for the internal polar layer. Comparing the size and the voltage resistance with the MLCC formed by the traditional dot blade method—both the dry process and the wet process, the MLCC produced by the vacuum sputtering process is finer and thinner; comparing the layer number and the capacitance with the MLCC formed by the tradition dot blade method, the MLCC produced by the vacuum sputtering process has greater layer number and larger capacitance in the same size. When comparing with the layer number and the capacitance, the MLCC formed by the vacuum sputtering process has lesser layers.