An ultraviolet curable resin composition is provided, which is excellent in developing width and resolution, and exhibits good solder heat resistance and resistance to gold plating. This resin composition comprises (A) an ultraviolet curable resin obtained by reacting an epoxy-group containing polymer (a), which is prepared by polymerizing an ethylenically unsaturated monomer component including an ethylenically unsaturated monomer (i) having an epoxy group, with an ethylenically unsaturated monomer (b) having a carboxyl group to obtain an intermediate product, and then reacting the intermediate product with a saturated or unsaturated polybasic acid anhydride (c); (B) an epoxy compound having at least two epoxy groups in its molecule; (C) a photo-polymerization initiator; (D) a diluent; and (E) an ultraviolet curable resin obtained by reacting a novolac epoxy compound (e) with the ethylenically unsaturated monomer (b) having a carboxyl group, and then reacting a resultant intermediate product with the saturated or unsaturated polybasic acid anhydride (c). The ultraviolet curable resin (E) has an acid value of 10 mgKOH/g or more and less than 45 mgKOH/g.