A head suspension or head suspension component for use in supporting a read/write head in a storage device, the head suspension or head suspension component including an integrated circuit chip as a structural element of the head suspension or head suspension component. The chip is included as part of a load beam or as a stiffener for a load beam. A flexure or other gimballing device is mounted to the chip or to a portion of the load beam that is mounted to the chip. The chip may be configured for improved heat dissipation or resonant characteristics. The chip is mounted to head suspension components in various ways, including the use of attachment features formed in the chip. A method of making a head suspension or head suspension component that includes mounting a chip as a structural element of the head suspension or head suspension component is also included.