A covering system is designed as an elongated strip of covering material having a fibrous layer and an integral moldable layer for mounting on the upper surface of boards, such as deck planks. In a preferred embodiment, strips are preferably secured to the length of the boards solely by a layer of a hot melt pressure sensitive adhesive carried by the strip. The moldable material is applied in a volume of about at least 185 grams per square meter. A removable release sheet covers the adhesive surface of the moldable material. The release sheet can include a positioning mechanism and indicia such as the direction of the pile and measuring guides. The moldable material provides sufficient adhesion across the width of the strip for both initial application and sufficient thickness for subsequently molding to the board surface for long term adhesion.