A sub-mount (7) provided with a laser chip (8) and a light receiving element (5) for monitoring is bonded to a die pad portion (2a) of a first lead (2). An electrode of the laser chip and an electrode of the light receiving element are electrically connected to second leads (3, 4) by wires such as metallic wires, not shown, respectively. A resin frame (6) is provided to cover sides and a rear surface side of the sub-mount except for an emission surface side of the laser chip and to integrally hold one end portion sides of the first and second leads. An antireflection unit (9) for preventing light from being reflected on the light receiving element is formed on a portion of the resin frame opposite to the rear end face of the laser chip. As a result, it is possible to obtain a mold type semiconductor laser capable of constantly detect accurate laser chip output and capable of forming an accurate optical output control circuit.