A height-restriction plate having a size in plan view larger than that of an IC chip is bonded to an upper face of the IC chip which is fixed to a FPC formed along a suspension. The IC chip is sealed at the periphery thereof with an adhesive which reaches the height-restriction plate and the FPC.

 
Web www.patentalert.com

< Thin film head with nickel-iron alloy non-magnetic substratum between non-magnetic gap layer and upper magnetic pole layer

< Magnetic head apparatus, magnetic reproducing method, and magnetic reproducing apparatus in linear tape system

> Data storage device with damped load arm formed from Mn-Cu alloy composition

> Low stiffness, high torsion suspension
~ 00223