A printed wiring board design aiding system comprises a first unit which acquires design layout information regarding a printed wiring board targeted for design, a second unit which acquires setting parameter information for the printed wiring board, which is targeted for design, and a third unit which estimates a value of the thickness of each of insulation layers of the printed wiring board in a post-manufacture state in accordance with the information acquired by the first unit and the information acquired by the second unit, and for outputting an estimated value.

 
Web www.patentalert.com

< Methods of calibrating and controlling stepper exposure processes and tools, and system for accomplishing same

< Method of thinning semiconductor wafer capable of preventing its front from being contaminated and back grinding device for semiconductor wafers

> Integrated polishing and electroless deposition

> Method for determining etching process conditions and controlling etching process
~ 00225