A process for fabricating a vertical spiral inductor within a multichip module package is disclosed. The process consists of depositing a pattern of bottom lines by electroplating copper on a substrate and then depositing an insulation pattern. Next, depositing a pattern of permeable material to form a core and then depositing polyimide to define vias and permeable core insulation. The vias are filled by electroplating copper. The vertical spiral inductor is formed and defined by next depositing a pattern of top metal (e.g. copper) lines by electroplating wherein the top metal lines are staggered with respect to the bottom metal lines. Lastly a top protective layer is deposited. The core is made from a permeable or non-permeable material.