A method for evaluating a wafer configuration includes: obtaining plural wafer configuration profiles from a central wafer portion to an edge portion along the entire periphery at a prescribed angular space; providing a first region for calculating a reference line for each profile in the central side of the wafer; calculating the reference line in the first region; providing a second region in the peripheral side of the wafer outside the first region; extrapolating the reference line calculated in the first region to the second region; analyzing a value obtained by subtracting the reference line value in the second region from an actually measured value in the second region; calculating the maximum value among the values as a surface characteristic and the minimum value among the values as a surface characteristic; and, evaluating configuration uniformity in the peripheral portion of the wafer from plural surface characteristics and surface characteristics.