A flip-chip type semiconductor device includes a semiconductor chip having electrode pads formed and arranged on a chip surface thereof. Sprout-shaped metal bumps are bonded to the electrode pads on the chip, and an adhesive resin layer is formed on the chip surface of the chip such that tip ends of the sprout-shaped metal bumps are protruded from the adhesive resin layer. A circumference of the tip end of each sprout-shaped metal bump is surrounded by a protective resin material integrally swelled from the adhesive rein layer such that a tip end face of each sprout-shaped metal bump is at least exposed to the outside.

 
Web www.patentalert.com

< Ultra high frequency radio frequency identification tag

< Medical image service method, medical software service method, medical image central management server apparatus, medical software central management server apparatus, medical image service system and medical software service system

> Method for fixing a lens of an optic group with respect to an optical sensor inside an electronic device able to acquire images and corresponding device

> Method and apparatus for image processing

~ 00226