A ruggedized electronics sub-system module is disclosed. The ruggedized electronics sub-system module includes a ruggedized housing and an electronic device supported by the housing. The ruggedized electronics sub-system module also includes an electrical connector coupled to the electronic device and supported by the housing. The ruggedized electronics sub-system module further includes a plurality of ruggedized cooling pins extending from the housing. The plurality of pins are spaced so as to allow for natural convective currents or forced air to be used for cooling the electronic device.