Embodiments of the present invention overcome the disadvantages of the metal bond head systems while also providing a method for performing precision die bond of multiple die at once. A mounting system is adapted for simultaneous high accuracy placement of multiple semiconductor components or dies on substrates. Simultaneous high accuracy multiple die placement is achieved by providing a mounting head assembly, including a see-through (ST) bond head with selectively and independently controlled gripping mechanisms, with moving and/or adjusting mechanisms adapted for accurate alignment of semiconductor components relative to a substrate in all directions.