A method of adhesive bonding by electric field. The method includes providing at least two adherends to be bonded, providing an electro-active adhesive between the at least two adherends, wherein the electro-active adhesive includes a multiplicity of electro-active particles and an adhesive binder, and applying an electric field to change the adhesion of the electro-active adhesive system to at least one of the adherends. Various carriers for microelectronic devices including electro-active adhesive contact surfaces are also included within the scope of the invention.