An input circuit for an integrated circuit (IC), which is mounted on a package having an input pin, rejects signal energy at a first frequency. A first bondwire arranged on the package has one end that communicates with the pin and an opposite end that communicates with components of the IC. A second bondwire located on the package has one end that communicates with the pin and an opposite end that communicates with a capacitance. The capacitance and an inductance of the first and second bondwires resonate at the first frequency to reject signal energy at the first frequency. Bondwires are also used to eliminate external components such as resonant components and impedance matching circuits to reduce cost.