What is invented is a semiconductor device (10) comprising a pellet (12) having a ground electrode (18), an outside signal terminal (15) connected to the pellet (12), so as to receive signal which is likely to include noise. Therein, said outside signal terminal (15) is surrounded with a ground terminal (17) connected to said ground electrode (18) in at least a half periphery.

 
Web www.patentalert.com

< Semiconductor device including high speed transistors and high voltage transistors disposed on a single substrate

< Electronic component having stacked semiconductor chips in parallel, and a method for producing the component

> Multi function package

> Stacked packages
~ 00227