The present invention provides an optical semiconductor device comprising: a
wiring circuit board; at least one optical semiconductor element mounted on the
wiring circuit board; resin layer A that encapsulates the at least one optical
semiconductor element therewith; and resin layer B interposed between the resin
layer A and the wiring circuit board, and having a tensile modulus as measured
at 30 C. of 0.001 to 0.4 GPa.