Apparatus and methods for packaging optical communication devices include
optical bench structures, such as silicon-optical benches (SiOB). An optical communications
apparatus includes an optical bench comprising a substrate having an electrical
turning via formed therein. An optoelectronic (OE) chip and integrated circuit
(IC) chip are mounted on the optical bench and electrically connected using the
electrical turning via. The electrical turning via extends in directions both perpendicular
and transverse to a surface of the substrate such that the OE chip and IC chip
can be mounted on perpendicular surfaces of the optical bench in close proximity
and electrically connected using the electrical turning via. More specifically,
the OE chip and IC chip are mounted on the optical bench such that a light-emitting
or light-detecting surface of the OE chip is substantially perpendicular to a surface
of the IC chip having contacts, and such that optical transmission lines that are
mounted parallel to the substrate surface can be directly coupled to the OE chip.