A design and method for attaching an RFID chip to a conductive pattern is disclosed. According to the invention, multiple die are aligned with respective multiple conductive modules for structural and electrical attachment. As disclosed, the multiple die can be attached near simultaneously and without the need for intermediate handling. Therefore, substantial cost benefits are realized. Also disclosed is a method of making electrical connections employing the use of a laser. A photosensitive adhesive material is used to structurally secure the attachment.