This invention relates to a siloxane-modified polyimide resin which shows excellent adhesiveness and can be bonded by thermocompression at high temperature even after subjection to thermal hysteresis in the manufacturing step for electronic parts. This polyimide resin is obtained from an aromatic tetracarboxylic acid dianhydride (A) and a diamine (B) comprising 30-95 mol % of a bis(4-aminophenoxy)alkane (B1) and 5-70 mol % of a siloxanediamine (B2) as essential components.