A method for manufacturing an embossed surface including a polymer composition having reactive moieties and a first glass transition temperature of T_g1. The method includes embossing the surface at temperature T_emb; and raising the first glass transition temperature T_g1 of the embossed polymeric surface to a second glass transition temperature T_g2 such that T_g2T_emb. In another embodiment, a method for improving the release of a polymeric surface from an embossing tool includes incorporating of one or more of fluorine atoms, silicon atoms, or siloxane segments into the backbone of the polymer. The methods are particularly suited for direct patterning of photoresists, fabrication of interdigitated electrodes, and fabrication of data storage media.