An electronic semiconductor device includes a semiconductor chip, which has an active chip area enclosed by an elevated metal frame. A plastic housing has a cutout for the active chip area within the metal frame, which permits passage of signals to or from the active chip area.

 
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< High-voltage lateral transistor with a multi-layered extended drain structure

< Methods and apparatus for particle reduction in MEMS devices

> Stackable semiconductor package with solder on pads on which second semiconductor package is stacked

> Wafer-level chip-scale package
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