A semiconductor package device includes an insulative housing, a semiconductor chip and a conductive trace, wherein the insulative housing includes a top surface, a bottom surface, and a peripheral side surface between the top and bottom surfaces, the chip includes a conductive pad, the conductive trace includes a routing line, a terminal and a lead, the terminal protrudes downwardly from and extends through the bottom surface and is electrically connected to the pad, the lead protrudes laterally from and extends through the side surface and is electrically connected to the pad, the terminal and the lead are spaced and separated from one another outside the insulative housing, and the terminal and the lead are electrically connected to one another by the routing line inside the insulative housing and outside the chip.