A method of making a semiconductor package device includes providing an insulative housing, a semiconductor chip, a terminal and a lead, wherein the insulative housing includes a top surface, a bottom surface, and a peripheral side surface between the top and bottom surfaces, the chip includes a conductive pad, the terminal protrudes downwardly from and extends through the bottom surface, the lead protrudes laterally from and extends through the side surface, the terminal and the lead are spaced and separated from one another outside the insulative housing, and the terminal is electrically connected to the lead and the pad inside the insulative housing and outside the chip, singulating the lead from a lead frame, and trimming the lead without trimming the terminal.