A charge air cooler formed of copper or a copper alloy for withstanding high temperatures and high pressures is described. The charge air cooler is made to withstand temperatures over about 300 C. and pressures greater than about 40 bars in one embodiment, and temperatures over about 600 C. and pressures greater than 40 bars in additional embodiments. The heat transfer tubes are connected to manifolds at either end. The manifolds are preferably formed of copper or copper alloy with the tubes mechanically joined thereto. In one embodiment, the tubes are arranged in alternating angles with respect to each other. In a preferred embodiment, the tubes are arranged in offset alternating angles with respect to each other.