Novel silicon-containing polymers are obtained by copolymerizing a vinylsilane
monomer with a compound having a low electron density unsaturated bond such as
maleic anhydride, maleimide derivatives or tetrafluoroethylene. Using the polymers,
chemical amplification positive resist compositions sensitive to high-energy radiation
and having a high sensitivity and resolution at a wavelength of less than 300 nm
and improved resistance to oxygen plasma etching are obtained.