An optical subassembly (OSA) with components including a microelectromechanical structure (MEMS) is formed with a jig. The jig includes a jig clamp and a jig stencil and allows for the optical components of the OSA to be optically aligned to one another using passive alignment. The jig stencil includes openings for the optical components and have an edge with a retractable portion that urge the optical components into position. The optical components are fixed in position by soldering, and the retractable portions allow for the jig stencil to move relative to the fixed components to avoid misalignment of the OSA components during cooling. The MEMS is then adjusted to maximize optical power directed from a light source, through the optical components, and into an optical transmission medium.