An aerosol stream of particles of a conductive material is directed into a via of an integrated circuit device to deposit the conductive material within the via to form a via plug.

 
Web www.patentalert.com

< Etalon positioning using solder balls

< Organic semiconductor element having high insulation strength and fabrication method thereof

> Color filter configuration for a silicon wafer to be diced into photosensitive chips

> Memory device utilizing vertical nanotubes
~ 00238