A silicon-containing composite body that would otherwise be brittle can be engineered to exhibit enhanced fracture toughness. Specifically, a silicon-ceramic composite body is produced, preferably by a reactive infiltration technique. The ceramic is selected such that it has a higher coefficient of thermal expansion (CTE) than does the silicon phase. At least at some point during processing, the silicon phase is at a temperature above its normal ductile/brittle transition temperature of about 500 C., and preferably above its melting point. The formed composite body containing the silicon phase is then cooled below its ductile/brittle transition. During cooling, the ceramic phase shrinks more than does the silicon phase, thereby placing the latter in a state of compressive stress. By the time the composite body has cooled to substantially ambient temperature, the induced compressive stress in the silicon phase is sufficient as to impart a measurable degree of semi-ductile character to the silicon phase. This pseudo-ductility manifests itself in the composite body as a significant increase in the fracture toughness of the body. For example, when the ceramic reinforcement was boron carbide particulate instead of silicon carbide (which has a CTE similar to that of silicon), fracture toughness increased by almost 30 percent.

 
Web www.patentalert.com

< Carbon nanotube product comprising single-walled carbon nanotubes

< Macrocyclic polyester oligomers and processes for polymerizing the same

> Flame retardant for polymeric materials

> Integrated circuits using optical waveguide interconnects formed through a semiconductor wafer and methods for forming same

~ 00239