An apparatus in one example includes a compliant component for supporting an
electrical
interface component that serves to electrically and mechanically couple a die with
a separate layer. In one example, the compliant component, upon relative movement
between the die and the separate layer, serves to promote a decrease in stress
in one or more of the die and the separate layer. The apparatus in another example
includes a compliant component for supporting an electrical interface component
that serves to create an electrical connection between a die and a separate layer.
The compliant component, upon relative movement between the die and the separate
layer, serves to promote maintenance of the electrical connection.