A heatsink device includes a heat conducting interface, a press plate mounted on the heat conducting interface, and a plurality of heat conducting metal threads pressed between the heat conducting interface and the press plate. Thus, the heat conducting metal threads are extended in a horizontal direction without bending or turning so as to dissipate the heat rapidly and smoothly, to prevent the heat from the heat source from being concentrated on the heat conducting interface, so that the heatsink device has the optimum heatsink effect.