A head stack assembly includes an actuator including an actuator arm, a load beam coupled to the actuator arm, and a gimbal coupled to the load beam. The gimbal is formed of an electrically conductive material. The head stack assembly further includes a dielectric layer disposed upon the gimbal. The head stack assembly further includes a slider supported by the gimbal. The head stack assembly further includes slider conductive pads disposed upon the dielectric layer with the dielectric layer interposed between the slider conductive pads and the gimbal. The slider conductive pads are electrically connected to the slider. The head stack assembly further includes a ground conductive pad disposed upon the dielectric layer with the dielectric layer interposed between the ground conductive pad and the gimbal. The ground conductive pad is electrically connected to the slider and the gimbal for electrically grounding the slider.